Advanced packaging infrared lamp

Tue, 02 Jun 2026 06:06:46 +0800

On the advanced packaging floor, the thermal budget is razor-thin. A 2°C swing during photoresist bake can throw off critical dimensions, and the price of rework is measured in scrapped wafers. We built this infrared lamp to keep that thermal envelope nailed down—within spec, cycle after cycle. What matters under the hood It uses near-infrared (NIR) emitters for rapid, direct heating with sub-second response. Across the bake zone, wafer-level uniformity holds at ±0.1°C, so soft bake and hard bake profiles stay repeatable lot after lot. It’s cleanroom-ready for Class 1–100, with zero particle generation and a sealed, low-outgassing assembly. Output stays stable over 5,000+ hours, with less than 5% intensity drift—so the thermal budget stays consistent across your lithography stacks. Why it earns its keep in packaging The cadence is relentless: coat photoresist, soft bake, expose, develop, hard bake, then etch. This lamp holds bake temperature tightly, which cuts down linewidth variation and the scumming you see when the resist is underbaked. The fast ramp shortens cycle time without giving up profile control, and you use less energy because the emitter heats the wafer directly instead of the chamber. Fewer excursions, less scrap, and throughput you can bank on. A few practical notes The lamp drops into existing tracks, but you need to align the emitter zone carefully to the wafer path. Run a short qualification to lock in your soft bake and hard bake recipes, and confirm the cooling airflow hits your exhaust limits. Once it’s set, keep it on a preventive maintenance schedule—reflector cleanliness and temperature calibration have to stay in spec.

Advanced on Professional IR Heating Lamps

Advanced packaging infrared lamp